2024 International Conference on Solid State Devices and Materials

2024 International Conference on Solid State Devices and Materials

Sep 1 - Sep 4, 2024Arcrea HIMEJI
International Conference on Solid State Devices and Materials
2024 International Conference on Solid State Devices and Materials

2024 International Conference on Solid State Devices and Materials

Sep 1 - Sep 4, 2024Arcrea HIMEJI

[A-4-02]Electron Transport in Ge(Sn) n-type Metal-Oxide-Semiconductor Field-Effect Transistors at Cryogenic Temperatures

〇Yen-Yang Chen1, Kai-Ying Tien1, Chia-You Liu1, Wei-Hsiang Kao1, Jiun-Yun Li1,2(1. National Taiwan Univ. (Taiwan), 2. Taiwan Semiconductor Res. Inst. (Taiwan))
https://doi.org/10.7567/SSDM.2024.A-4-02
Direct-bandgap germanium-tin (GeSn) is a promising material owing to its high carrier mobility for high-performance logic devices. In this work, we investigate electron transport properties in Ge(Sn) n-type metal-oxide-semiconductor field-effect transistors (MOSFETs) with a Sn fraction up to 8 % at temperatures from 300 K to 4 K. For the Ge and Ge0.96Sn0.04 n-MOSFETs, the electron mobility decreases as the temperature decreases while the electron mobility of the Ge0.92Sn0.08 device is almost constant at 300 K ~ 4 K. We attribute this to an increased electron population in the direct Gamma-valley owing to the transition of indirect-bandgap to direct-bandgap GeSn at a Sn fraction ~ 8 %.