2024 International Conference on Solid State Devices and Materials

2024 International Conference on Solid State Devices and Materials

Sep 1 - Sep 4, 2024Arcrea HIMEJI
International Conference on Solid State Devices and Materials
2024 International Conference on Solid State Devices and Materials

2024 International Conference on Solid State Devices and Materials

Sep 1 - Sep 4, 2024Arcrea HIMEJI

[A-4-03]Te-based layered materials for Fermi-level Depinning on n-Ge

〇Wen Hsin CHANG1, Shogo HATAYAMA1, Naoya OKADA1, Toshifumi IRISAWA1, Yuta SAITO1,2(1. AIST (Japan), 2. Tohoku Univ. (Japan))
https://doi.org/10.7567/SSDM.2024.A-4-03
Feasibility of Te-based layered materials have been investigated on n-Ge as a S/D contact material. Bi2Te3/Ge quasi van der Waals contacts were found effective in suppressing strong Fermi-level pinning on n-Ge, resulting in a very small electron barrier height of < 0.1 eV. The Bi2Te3/n-Ge junction also shows very high thermal stability, featuring excellent ohmic behavior even after 400 °C annealing. Bi2Te3/Ge is a promising junction candidate for achieving low contact resistance Ge nFET.