International Conference on Solid State Devices and Materials

Package structure is becoming more complex to enable heterogeneous integration, compared to a single-chip flip-chip ball grid array (FC-BGA). Co-creation among material and equipment suppliers is mandatory to accelerate the research and development of the complex structures. Resonac established the co-creative packaging evaluation platform “JOINT2 (Jisso Open Innovation Network of Tops 2)” with leading companies of advanced materials, equipment and substrates for 2.xD and 3D package in 2021. In addition, the requirements from end-customers are quickly changing, as the technology for the latest applications such as generative artificial intelligence (AI) is rapidly evolving. Therefore, Resonac will make new consortium called “US-JOINT,” for proof of concept on package process in Silicon Valley, so that the consortium members can capture and verify the latest requirements for semiconductor packaging of advanced devices. This talk will cover the updates on our research and development and the overview of US-JOINT.