2024 International Conference on Solid State Devices and Materials

2024 International Conference on Solid State Devices and Materials

Sep 1 - Sep 4, 2024Arcrea HIMEJI
International Conference on Solid State Devices and Materials
2024 International Conference on Solid State Devices and Materials

2024 International Conference on Solid State Devices and Materials

Sep 1 - Sep 4, 2024Arcrea HIMEJI

[D-1-01 (Invited)]Pairing Ga2O3 with p-NiO produces robust power diodes for harsh environments

Hehe Gong1,2、Feng Zhou1、Ming Xiao2、Yuhao Zhang2、〇Jiandong Ye1(1. Nanjing University (China)、2. Virginia Tech (United States of America))
https://doi.org/10.7567/SSDM.2024.D-1-01
This work unveils the enabling edge termination for a robust, circuit-level avalanche in a UWBG NiO/Ga2O3 p-n heterojunction diode (HJD), and correlates the edge termination (ET) design with avalanche energy. Such ET combines a NiO junction termination extension (JTE) and a high-k oxide-based (BaTiO3) field plate. The ava-lanche voltage and current are enhanced from 761V/26A to 2135V/83A by lowering the p-type NiO doping in this high-k enhanced JTE. The achieved avalanche energy density (11.3 J/cm2) sets a new record in heterojunction devices and is comparable to the highest values reported in SiC and GaN homojunctions.