[J-1-02] Bringing Superconducting Al Overlap Josephson Junction Fabrication from Lab to Fab | 2024 International Conference on Solid State Devices and Materials

2024 International Conference on Solid State Devices and Materials

Sep 1 - Sep 4, 2024Arcrea HIMEJI

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2024 International Conference on Solid State Devices and Materials

Sep 1 - Sep 4, 2024Arcrea HIMEJI

[J-1-02]Bringing Superconducting Al Overlap Josephson Junction Fabrication from Lab to Fab

〇Shana Massar¹, Tsvetan Ivanov¹, Yann Canvel¹, Daniel Perez Lozano¹, Jacques Van Damme^1,2, Stefan Kubicek¹, Julien Jussot¹, Diziana Vangoidsenhoven¹, Yannick Hermans¹, Antoine Pacco¹, Ju-Geng Lai¹, Rohith Acharya¹, Vadiraj Rao¹, Massimo Mongillo¹, Anton Potočnik¹, Danny Wan¹, Kristiaan De Greve^1,2(1. IMEC (Belgium), 2. Katholieke Univ. Leuven (Belgium))

https://doi.org/10.7567/SSDM.2024.J-1-02

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A high yield 300 mm Al overlap Josephson junction process was developed in IMEC’s pilot line for quantum computing applications. Initial process development relied on ebeam lithography and later, on 193nm immersion optical lithography. Electrical measurements and physical inspections of the junctions highlight the impact of process variations on devices.

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