2024 International Conference on Solid State Devices and Materials

2024 International Conference on Solid State Devices and Materials

Sep 1 - Sep 4, 2024Arcrea HIMEJI
International Conference on Solid State Devices and Materials
2024 International Conference on Solid State Devices and Materials

2024 International Conference on Solid State Devices and Materials

Sep 1 - Sep 4, 2024Arcrea HIMEJI

[M-7-01 (Invited)]High-precision 3D integration of catalytic silicon nanowires for high performance electronics

〇Linwei Yu1(1. Nanjing Univ. (China))
https://doi.org/10.7567/SSDM.2024.M-7-01
Ultrathin silicon nanowires (SiNWs) are the ideal building blocks to construct field effect transistors (FETs) and sensors, thanks to their quasi-one-dimensional (1D) geometry and excellent electrostatic control. Though excellent FETs and sensors have been successfully demonstrated based on the SiNWs, grown via vapor-liquid-solid (VLS) mechanism, it is still difficult to achieve a precise position control of millions of catalytic SiNWs for a scalable integration of high-performance electronics. In this talk, we will introduce a relatively new in-plane solid-liquid-solid (IPSLS) growth mechanism, where metallic catalyst droplets consume pre-coated amorphous Si (a-Si) precursor to produce planar crystalline SiNWs. In this way, the IPSLS growth can be steadily guided by surface steps/grooves, to integrate ultrathin SiNWs, with CD<10 nm, into high-density array on planar surface or stacked on the vertical sidewalls. Based on these designable SiNW channels, high performance FET devices were successfully demonstrated, with high Ion/Ioff current >10^7 and subthreshold swing <70 mV/dec.