[18p-B2-1~15] 4.6 Terahertz Photonics

17:15 〜 17:30英語発表

[18p-B2-12] 3D-printed Packaging for Terahertz Silicon Waveguides

〇(P)Ngo Hoai Nguyen¹, Weijie Gao¹, Mingxiang Li², Daiki Ichikawa¹, Yoshiharu Yamada³, Hidemasa Yamane³, Shuichi Murakami³, Withawat Withayachumnankul², Masayuki Fujita¹ (1.Osaka University, 2.Univ. of Adelaide, 3.ORIST)

キーワード：

non-metallic waveguide、terahertz、3D-printing

In recent years, the rapid development of terahertz (THz) measurement devices has necessitated the utilization of waveguides for coupling signals to the devices under test. Metallic hollow waveguides have been widely adopted for coupling purposes owing to their high coupling efficiency and compatibility with the equipment. As the frequency approaches 300 GHz and higher, the hollow core’s size shrinks to less than 1 mm, complicating micromachining and gold plating processes and leading to high fabrication costs. With the advancement of additive manufacturing technology, 3D-printed metallic waveguides have been developed with high accuracy and high coupling efficiency. Nevertheless, the optimization of post-process for metallization is required, and hence, increases the finishing complexity. All-dielectric waveguides are featured for their low loss, low dispersion, and flexible design. A drawback of this waveguide is the requirement of supporting frames. To address these problems, we propose non–metallic 3D-printed packages for all-silicon waveguides, targeting the WR-3.4 band (220–330 GHz).