講演情報
[11p-C214-3]Skin-interfaced ultrathin EGaIn electrodes with friction-durable encapsulation
〇Junyeong Lee1,2, Joosung Kim1, Sunghoon Lee1,2, Takao Someya1,2 (1.RIKEN, 2.Univ. of Tokyo)
キーワード：
Skin electronics
Gallium-based liquid metals, particularly eutectic gallium–indium (EGaIn), are attractive for stretchable electrodes because they combine metallic conductivity with fluidic deformability1. However, the intrinsic fluidity of EGaIn makes patterned electrodes susceptible to friction-induced damage during daily mechanical contact. To address this limitation, direct elastomer encapsulation and liquid-metal-particle/elastomer composites have been attempted to suppress friction-induced leakage2,3. However, direct encapsulation often requires thick protective layers that compromise mechanical deformability and conformability, whereas particle-based composites isolate individual liquid metal particles within insulating elastomer, limiting its direct particle to particle electrical contact. Therefore, to simultaneously achieve friction durability and conformability, a thin and friction-durable encapsulation strategy is needed.
Here, we present ultrathin EGaIn electrodes with friction-durable encapsulation for skin-interfaced soft electronics (Fig. 1a). Our strategy combines a Polyurethane (PU) – Polystyrene-block-poly (ethylene-ran -butylene)-block polystyrene (SEBS) nanomesh substrate, selectively patterned ultrathin EGaIn traces, and a 3-aminopropyltriethoxysilane (APTES)-assisted Polystyrene-block-poly(ethylene-ran-butylene)-block polystyrene-graft-maleic anhydride (SEBS-g-MA) friction-durable encapsulation layer. The fabricated electrodes showed high stretchability up to 120% strain and a low relative resistance change of 0.1 at 50% strain. The friction-durable electrodes maintained high impedance upon contact with PBS droplets after 1,000 friction cycles, demonstrating that the encapsulation preserved electrical insulation under repeated friction. These results demonstrate that ultrathin and friction-durable encapsulation can enable EGaIn-based soft electronics for daily skin-interfaced use.
Here, we present ultrathin EGaIn electrodes with friction-durable encapsulation for skin-interfaced soft electronics (Fig. 1a). Our strategy combines a Polyurethane (PU) – Polystyrene-block-poly (ethylene-ran -butylene)-block polystyrene (SEBS) nanomesh substrate, selectively patterned ultrathin EGaIn traces, and a 3-aminopropyltriethoxysilane (APTES)-assisted Polystyrene-block-poly(ethylene-ran-butylene)-block polystyrene-graft-maleic anhydride (SEBS-g-MA) friction-durable encapsulation layer. The fabricated electrodes showed high stretchability up to 120% strain and a low relative resistance change of 0.1 at 50% strain. The friction-durable electrodes maintained high impedance upon contact with PBS droplets after 1,000 friction cycles, demonstrating that the encapsulation preserved electrical insulation under repeated friction. These results demonstrate that ultrathin and friction-durable encapsulation can enable EGaIn-based soft electronics for daily skin-interfaced use.