講演情報
[8p-N304-2]Top-Down Fabricated 3D Flow-Splitting Structures for Enhanced Single-Phase Silicon Microchannel Cooling
〇(M2)claire damonville1, Yujiao Zhou1, Masahiro Nomura1 (1.IIS, The University of Tokyo)
キーワード：
Micro cooling、Chip water-cooling、CFD
The increasing power density of AI processors and high-bandwidth memory (HBM) demands advanced on-chip cooling solutions. Here, we present a silicon-based microfluidic cooling platform combining a tapered manifold and capillary-assisted microchannels for efficient single-phase water cooling. A tapered manifold nozzle is introduced to improve coolant distribution, while bottom-mounted flow-splitting microstructures enhance flow redistribution and temperature uniformity. The three-dimensional architecture is fabricated using a two-step DRIE process and wafer bonding, enabling complex flow geometries beyond conventional planar designs.CFD simulations and experimental characterization are performed to evaluate flow distribution, pressure drop, and cooling performance. The optimized design achieves a COP of over 108, representing an improvement of 9.78% compared with our previous architecture.These results demonstrate the potential of top-down fabricated 3D silicon microfluidic structures for next-generation AI cooling applications.