2006 International Conference on Solid State Devices and Materials

2006 International Conference on Solid State Devices and Materials

2006年9月12日〜9月15日PACIFICO Yokohama, Yokohama, Japan
戻る
International Conference on Solid State Devices and Materials
2006 International Conference on Solid State Devices and Materials

2006 International Conference on Solid State Devices and Materials

2006年9月12日〜9月15日PACIFICO Yokohama, Yokohama, Japan

[A-3-5]MEMS Wafer Level Packaging by Using Surface Activated Bonding

Yoshiyuki Takegawa、Toru Baba、Takafumi Okudo、Yuji Suzuki(1.EMIT Devices Development Department、2.Micro Fabrication Process Development Center, Matsushita Electric Works, Ltd.)
https://doi.org/10.7567/SSDM.2006.A-3-5
PDFダウンロードPDFダウンロード
戻る