2017 International Conference on Solid State Devices and Materials

2017 International Conference on Solid State Devices and Materials

2017年9月19日〜9月22日Sendai International Center
International Conference on Solid State Devices and Materials
2017 International Conference on Solid State Devices and Materials

2017 International Conference on Solid State Devices and Materials

2017年9月19日〜9月22日Sendai International Center

[A-7-01]The Experimental Observations of a New Dielectric-fuse Breakdown in a Bilayer-RRAM to Realize the OTP Functionality

E. R. Hsieh1, H. W. Cheng1, Z. H. Huang1, C. H. Chuang1, C. H. Chen1, S. Chung1(1.National Chiao Tung Univ. (Taiwan))
https://doi.org/10.7567/SSDM.2017.A-7-01