2017 International Conference on Solid State Devices and Materials

2017 International Conference on Solid State Devices and Materials

2017年9月19日〜9月22日Sendai International Center
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International Conference on Solid State Devices and Materials
2017 International Conference on Solid State Devices and Materials

2017 International Conference on Solid State Devices and Materials

2017年9月19日〜9月22日Sendai International Center

[B-1-04 (Late News)]Compression of Organic Thin-films by Cold Isostatic Pressing for Enhanced Device Properties

○Y. Esaki1, T. Matsushima1,2,3, C. Adachi1,2,3(1.Kyushu Univ. (Japan), 2.JST ERATO (Japan), 3.WPI-I2CNER (Japan))
https://doi.org/10.7567/SSDM.2017.B-1-04
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