Presentation Information

[2P06]Multidimensional behavior of transient boiling flow in a heated 5 × 5 rod bundle under depressurization process

*Shota Ueda1, Takahiro Arai1, Masahiro Furuya1, Riichiro Okawa1, Atsushi Ui1, Kenetsu Shirakawa1, Wataru Sakuma2 (1. CRIEPI, 2. MHI)

Keywords:

Boiling flow,Depressurization process,5×5 rod bundle,Void fraction distribution,SubChannel Void Sensor

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