Presentation Information
[SuB4-03]Oxide semiconductor transistor technology for future 3D LSIs
〇Nobuyoshi Saito1, Keiji Ikeda1, Mutsumi Okajima1 (1. KIOXIA Corporation (Japan))
Oxide semiconductor has gained much attention as a channel material for monolithic 3D LSIs thanks to its low-temperature fabrication and ultralow off-leakage current characteristics. We review the recently proposed 3D LSI devices integrated with oxide semiconductors and their challenges beyond display applications. We also demonstrate 3D replacement-type oxide semiconductor transistors for future 3D DRAM. Oxide semiconductor transistor is a key technology for future high-density and low-power 3D LSIs.
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