Presentation Information

[2C18]ケナフ由来リグニン系バインダの熱処理条件とSi負極の電極特性

*Takuya Eguchi1, Reiichi Chiba1, Masanori Ikeda1, Seiji Kumagai2, Daisuke Tashima3 (1. Nihon University (Japan), 2. Akita University (Japan), 3. Fukuoka Institute of Technology (Japan))

Keywords:

Silicon,Lignin-based binders,Heat-treatment temperature