[C-10] 電子デバイス

9:30 AM - 9:45 AM JST(12:30 AM - 12:45 AM UTC)

[C-10-03] Fundamental Study on Thermal Via Placement of Sub-THz Band AiP Module

○Akihiro Egami¹, Yoichi Nakagawa¹, Makoto Tsukahara² (1. Panasonic Industry, 2. Shinko Electric Industries)

Keywords:

sub-THz,thermal via,heat dissipation,antenna in package,module