Presentation Information
[C-2B-16]Measurement of Chip-to-Chip Insertion Loss in WLP from DC to 220 GHz for Ultra-High-Speed PD
〇Yusuke Araki1, Yuki Yamada1, Yuta Shiratori1, Fumito Nakajima1 (1. Device Technology Labs., NTT, Inc)
Keywords:
WLP,packaging
