Presentation Information

[C-3_C-4-38]p-i-n type Mach-Zehnder IQ modulators integrating InP-based multiple quantum wells on Si waveguides by using chip-on-wafer bonding technology

〇Hajime Tanaka1,2,3, Naotaka Kasuya1,2,3, Taichi Misawa2, Kento Komatsu1,2,3, Naoko Inoue1,2,3, Takehiko Kikuchi1,2,3, Takuya Mitarai1,2,3, Shun Kimura1,2, Naoki Fujiwara1,2,3, Nobuhiko Nishiyama1,3, Hideki Yagi1,2,3 (1. Photonics Electronics Technology Research Association, 2. Sumitomo Electric Industries, Ltd. , 3. Institute of Science Tokyo)

Keywords:

Modulator,InP,Si waveguide,Chip-on-wafer bonding

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