[C-3_C-4] Optoelectronics / Lasers and Quantum Electronics

3:45 PM - 4:00 PM JST(6:45 AM - 7:00 AM UTC)

[C-3_C-4-39] III-V membrane/Si MOS type Mach-Zehnder modulators by using chip-on-wafer bonding technology

〇Naotaka Kasuya^1,2,3, Kento Komatsu^1,2,3, Hajime Tanaka^1,2,3, Naoko Inoue^1,2,3, Takehiko Kikuchi^1,2,3, Takuya Mitarai^1,2,3, Shun Kimura^1,2, Naoki Fujiwara^1,2,3, Mitsuru Takenaka⁴, Nobuhiko Nishiyama^1,3, Hideki Yagi^1,2,3 (1. Photonics Electronics Technology Research Association, 2. Transmission Devices Laboratory, Sumitomo Electric Industries, Ltd., 3. Dept. of Electrical and Electronic Engineering, Institute of Science Tokyo, 4. Dept. of Electrical Engineering and Information Systems, The University of Tokyo)

Keywords:

III-V/Si heterogeneous integration,Mach-Zehnder modulator,MOS structure

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