Presentation Information

[C-6-01]Characterization of SiOx Films Deposited without Heating

〇Mayumi B. Takeyama1,2, Masaru Sato1 (1. Kitami Institute of Technology, 2. Science Tokyo, WOW aliance)

Keywords:

3D-LSI,Cu interconnect,low-temperature process,insulating film,SiO2 film