Presentation Information
[C-6-01]Characterization of SiOx Films Deposited without Heating
〇Mayumi B. Takeyama1,2, Masaru Sato1 (1. Kitami Institute of Technology, 2. Science Tokyo, WOW aliance)
Keywords:
3D-LSI,Cu interconnect,low-temperature process,insulating film,SiO2 film
