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Flip-Chip Photonic-Electronic Integration Platform for Co-Packaged Optics Using a Glass Substrate With Vertically-Coupled Beam Expanding Lens

<a style="color: #ffffff; background-color: #3598db;" href="https://us02web.zoom.us/j/88485866773" target="_blank" rel="noopener">　Online Attendance (ZOOM)　</a>

As artificial intelligence (AI) becomes increasingly prevalent, it is rapidly permeating our daily lives and evolving at an accelerating pace. However, the semiconductor devices that support AI are facing significant challenges. With the end of Moore's Law, the progress of miniaturization has slowed, prompting the need for new technological approaches. Recent innovations such as chiplet technology - which enables multiple chips to function as a single unit on a substrate - and 3D integration using hybrid bonding, particularly in applications like High Bandwidth Memory (HBM), are driving continued advancement in semiconductor performance. Additionally, emerging technologies such as optoelectronic integration for data communication between GPUs and server racks, and substrates with embedded passive components, are beginning to be implemented and are expected to play a vital role in the future evolution of AI. This symposium will focus on the cutting-edge device technologies that are powering the future of AI, aiming to deepen understanding of the latest developments and their potential impact.

Device Technologies Powering the Future of AI

General Conference of the Institute of Electronics, Information and Communication Engineers

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[CI-2-03]Flip-Chip Photonic-Electronic Integration Platform for Co-Packaged Optics Using a Glass Substrate With Vertically-Coupled Beam Expanding Lens

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