Presentation Information
[AS-1-03]Impact of Device Architecture on the Thermal Management of AlGaN Semiconductor Devices
*Kidus Guye1, E. G. Jurcik1, D. Orlandini2, Y. Zhu2, A. Allerman3, H. Aller1, S. Rajan2, J. S. Lundh4, K. Hobart4, D. Agonafer1, S. Graham1 (1. Department of Mechanical Engineering, University of Maryland, College Park, MD 20740, USA, 2. Department of Electrical and Computer Engineering, The Ohio State University, 3. Sandia National Laboratories, Albuquerque, New Mexico 87123, USA , 4. US Naval Research Laboratory, Washington, DC, USA)
