OS05(3) Advanced cutting technologies (3)

5:00 PM - 5:15 PM JST(8:00 AM - 8:15 AM UTC)

[OS05-11-01] Suppression of Interface Damage in Ultrasonic Elliptical Vibration Cutting of Semiconductor Interposer Substrates

*Shugo Takemasa^1,2, Kota Hamanaka^1,2, Hiroto Shimazu^2,3, Norio Yamashita², Takashi Michikawa^2,4, Shinya Morita^1,2, Hideo Yokota² (1. Tokyo Denki University, 2. RIKEN, 3. Tokyo University of Science, 4. The University of Osaka)

Password required to view