[OS05(3)] OS05(3) Advanced cutting technologies (3) | ICPE2026

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Technical SessionOS05(3) Advanced cutting technologies (3)

OS05(3) Advanced cutting technologies (3)

Mon. Nov 16, 2026 4:30 PM - 5:30 PM JST
Mon. Nov 16, 2026 7:30 AM - 8:30 AM UTC

Room1 (1003)

Takashi Matsumura (Tokyo Denki University)

4:30 PM - 4:45 PM JST(7:30 AM - 7:45 AM UTC)

[OS05-9-01]Effects of ultrasonic-vibration-assisted coolant on machining characteristics of Ti using cBN tool

*Masaru Kajiwara¹, Hirofumi Suzuki¹, Tatsuya Furuki¹, Akinori Yui¹, Koichi Okada², Takeshi Watanabe² (1. Chubu Univ., 2. NS Tool)

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4:45 PM - 5:00 PM JST(7:45 AM - 8:00 AM UTC)

[OS05-10-01]Improving Surface Quality and Machining Stability in Ultra-Precision Diamond Cutting of 6061 Aluminum Alloy by Magnetic Field Assistance

*Ling Lei¹, Suet To¹, Wai Sze Yip¹ (1. The Hong Kong Polytechnic University)

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5:00 PM - 5:15 PM JST(8:00 AM - 8:15 AM UTC)

[OS05-11-01]Suppression of Interface Damage in Ultrasonic Elliptical Vibration Cutting of Semiconductor Interposer Substrates

*Shugo Takemasa^1,2, Kota Hamanaka^1,2, Hiroto Shimazu^2,3, Norio Yamashita², Takashi Michikawa^2,4, Shinya Morita^1,2, Hideo Yokota² (1. Tokyo Denki University, 2. RIKEN, 3. Tokyo University of Science, 4. The University of Osaka)

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5:15 PM - 5:30 PM JST(8:15 AM - 8:30 AM UTC)

[OS05-12-01]Mechanism of Strain Rate Variation in Ultrasonic Vibration Cutting

*Ryo Taniguchi¹, Naofumi Tsuji², Keisuke Hara³, Hirofumi Kawamura¹, Hiromi Isobe¹ (1. Nagaoka University of Technology, 2. National Institute of Technology, Akita College, 3. National Institute of Technology, Ichinoseki College)

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