[Tu-P] Material growth, structural properties, and characterization (bulk, nanowires, dots)

[Tu-P-17] Shear-Induced Phase Transformations in Silicon During Saw Dicing

〇Zainab -^1,2, Jörg Debus¹, Hannes Kurtze² (1. Technical Univ. Dortmund (TUD) (Germany), 2. Anhalt Univ. of Applied Sci. (Germany))

Raman spectroscopy reveals that saw dicing silicon wafers induces metastable phase transformations (BC8 and R8) driven by shear stress. This creates a spatial gradient mainly concentrating transformations at the wafer's top where shear stress peaks which happens particularly at lower feed rates.