[Fr-3B] Materials and Wafer Processing

2:20 PM - 2:40 PM JST(5:20 AM - 5:40 AM UTC)

[Fr-3B-02] Using multi-spectral linear absorption imaging for volumetric defect tracking and classification in optically transparent 4H-SiC wafers at industrial scale.

*Jimmy Thörnberg¹, Torben L. Purz², Anton Vakulenko², Eric W. Martin², Björn Magnusson¹ (1. STMicroelectronics Silicone Carbide AB (Sweden), 2. MONSTR Sense Technologies (USA))