Presentation Information
[Mo-P-10]Numerical Modeling of Residual Stress-Induced Wafer Warpage in 4H-SiC Substrates
*Magdalena Lang1, Paul Wimmer1, Marc Hainke1, Christian Kranert1, Jochen Friedrich1 (1. Fraunhofer Inst. for Integrated Systems and Device Technology IISB (Germany))