Presentation Information
[Mo-P-43]Evaluation of Processing Stability and Kerf Width Reduction in BPD-free Dicing of SiC Wafer Using Water Jet Guided Laser
*Hyuk Kim1, Shunya Hirano1, Satoru Takahashi2, Shuzo Masui2, Noboru Ohtani3, Kozo Abe3 (1. MAKINO MILLING MACHINE CO., LTD. (Japan), 2. The University of Tokyo (Japan), 3. Kwansei Gakuin University (Japan))