[Th-P] Poster Session

[Th-P-19] Thermal Probe (TP) Measurements for Ion Implantation Monitoring on Silicon Carbide Substrates

*Sedat Dogan¹, Axel Koenig¹, Martin Haberjahn^2,3, Tetyana Shapoval³, Refat Soliman³, Jie Zhu⁴ (1. Infineon Technologies Austria AG (Austria), 2. Infineon Technologies AG (Austria), 3. KLA Corporation (Germany), 4. KLA Corporation Shanghai (China))