Presentation Information
[Th-P-55]Reliability Impact of Laser-Sawing-Induced Sidewall Damage and Backside Recast Residue in SiC MOSFET Packaging
*Pei-Huan Lee1, Hong-Rui Huang1, Chien-Hsiung Huang1, Cheng-Yen Lin1, Yu-Hsien Lai1, Hsin-Chung Tsai1, Hyper Chang1 (1. ACTRON TECHNOLOGY Corp. (Taiwan))