[Th-P] Poster Session

[Th-P-59] Unified Planarization and Thinning of Extracted 4H-SiC Layers for
Engineered Substrate Applications

*Hitesh Jayaprakash^1,2,3, Masum SM^3,2, Michael Rueb^2,3, Sileno Carmine⁴ (1. Freidrich Alexander Univ., Erlangen (Germany), 2. mi2-factory GmbH (Germany), 3. Ernst-Abbe-Hochschule, Jena (Germany), 4. Meister Abrasives (Switzerland))