Presentation Information
[Tu-3A-03]XPS Evaluation of Etch Damage and Nitrogen Incorporation in 4H-SiC Trenches
*Runze Wang1, Mingsheng Zhang2, Hwee Leng Seng2, Rong Ji2, Jisheng Pan2, Zijie Zheng1,3, Yu-Chieh Chien1, Xiaolin Wang1,3, Leming Jiao1,3, Liyuan Liu1, Abdul Hannan Yeo1, Qin Gui Voo1, Umesh Chand1, Xiao Gong1,3, Navab Singh1, Yee Chia Yeo1,3 (1. Inst. of Microelectronics (IME), A*STAR (Singapore), 2. Inst. of Materials Res. and Eng. (IMRE), A*STAR (Singapore), 3. National Univ. of Singapore (Singapore))
