Presentation Information
[We-P-70]Toward Multiscale Evaluation of 4H-SiC Wafer Quality by Integrating Wafer-Scale Signatures and Microscopic Defect Inspection
*Koji Ashida1, Daichi Dojima1, Mariko Takahara1, Shota Fujiki3, Kohei Toda1, Hiroshi Mihara1, Mari Yamamoto3, Tadaaki Kaneko1,2 (1. QureDA Research, Inc. (Japan), 2. Kwansei Gakuin University (Japan), 3. Lasertec Corporation (Japan))