Presentation Information
[FLXp1-10L]Press-Sensitive Adhesives With Low Dielectric Loss for Flexible Multi-Layered Electronic Components
*Min-Seok Jeon1, Jin-Sun Cha1, Jeong-Ryul Kim2, Duck-Hee Kim3, Yeon-Ho Jeong3 (1. Korea Testing Laboratory (Korea), 2. ICH Co. Ltd. (Korea), 3. APC Co. Ltd. (Korea))
Keywords:
Pressure-sensitive Adhesive,Dielectric Loss,Flexible Electronic Components,Adhesion,Tackifier
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