Presentation Information
[AMD6-1(Invited)]Brightness Enhancement in a GaN-Based LED Microdisplay with Aluminum Reflectors and On-Chip Lenses Using Pixel-Level Cu-Cu Connections
*Takanobu Akagi1, Haruki Tsuchiya1, Toshihiro Miura1, Ryosuke Matsumoto1, Mikio Takiguchi1, Toru Sasaki1, Michihiro Kanno1, Koichi Nagasawa1 (1. Sony Semiconductor Solutions Corporation (Japan))
Keywords:
microLED,microdisplay,active matrix,Cu-Cu hybrid bonding,augmented reality
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