[FMC6] Micro-LED Processes

4:40 PM - 5:00 PM JST(7:40 AM - 8:00 AM UTC)

[FMC6-3] From Chip to Panel: High-Brightness, Low-Power Mini-LED Backlighting via MicroLED-in-Package (MiP4)

*Chia-Hung Tsai^1,2, Chih-Jen Tsang³, Ming-Chuan Chih³, Chien-Chi Huang¹, Fang-Chung Chen¹, Hao-Chung Kuo¹, Simon Ogier² (1. National Yang Ming Chiao Tung University (Taiwan), 2. Smartkem Ltd. (UK), 3. Coretronic Corporation (Taiwan))

Keywords:

MicroLED-in-Package,Mini-LED Backlight,RDL Interconnection,Chip-First MicroLED Integration

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