Presentation Information
[3]From Chip to Panel: High-Brightness, Low-Power Mini-LED Backlighting via MicroLED-in-Package (MiP4)(20min.)
*Chia-Hung Tsai1,2, Chih-Jen Tsang3, Ming-Chuan Chih3, Chien-Chi Huang1, Fang-Chung Chen1, Hao-Chung Kuo1, Simon Ogier2 (1. National Yang Ming Chiao Tung University (Taiwan), 2. Smartkem Ltd. (UK), 3. Coretronic Corporation (Taiwan))
Keywords:
MicroLED-in-Package,Mini-LED Backlight,RDL Interconnection,Chip-First MicroLED Integration
Comment
To browse or post comments, you must log in.Log in