Presentation Information
[FMCp1-2]Scratch Resistance Enhancement for Array Backplanes via Passivation Layer and Metal Wire Optimization
*Jie Zhang1, Yi Chuan Zhang1, Zhong Ming Song1, Xing Xing Tang1, Zhen Liu1, He Jing Zhang1, James Hsu1, Wade Chen1 (1. Chongqing HKC Optoelectronics Technology Co., Ltd. (China))
Keywords:
Array Backplanes,Scratch Resistance,Passivation layer,Metal Wire
Password required to view
To view or download the proceedings, please log into your A-Pass using the "Log in" button.
If you do not have a A-Pass, enter the password provided by the IDW Secretariat in the designated box and click the "Authenticate" button.
If you do not have a A-Pass, enter the password provided by the IDW Secretariat in the designated box and click the "Authenticate" button.
Log in
or
Comment
To browse or post comments, you must log in.Log in