[O2-3] Thermal Management for Semiconductor Devices 1

3:30 PM - 3:50 PM JST(6:30 AM - 6:50 AM UTC)

[O2-3-04] Thermal and Mechanical Characterization of One-Component, Non-Curing Gap Fillers for Top-Side Cooled MOSFETs

*Joel Schön¹, Zerdest Pervane¹, Jörg Franke¹, Patrick Bründl¹ (1. Institute for Factory Automation and Production Systems, Universität Erlangen-Nürnberg (Germany))

Keywords:

Thermal Interface Material,Gap Filler,Power Electronics,Thermal Resistance