[O2-3] Thermal Management for Semiconductor Devices 1 | IPEC2026

Session Details

Regular SessionSemiconductor Power Conversion : Emerging technologies in Packaging, thermal management, system integration and Reliability (Advanced fault protection systems, Diagnostics)

[O2-3]Thermal Management for Semiconductor Devices 1

Mon. Jun 1, 2026 2:30 PM - 4:10 PM JST
Mon. Jun 1, 2026 5:30 AM - 7:10 AM UTC

Room 101C(1F)

Chair:Frede Blaabjerg(Aalborg University), Shuhei Fukunaga(The University of Osaka)

2:30 PM - 2:50 PM JST(5:30 AM - 5:50 AM UTC)

[O2-3-01]Advanced Thermal Management Solutions for WBG-based Integrated Modular Motor-Drives

*Alberto Castellazzi¹, Imad Mohamed Ameer¹ (1. Kyoto University of Advanced Science (Japan))

2:50 PM - 3:10 PM JST(5:50 AM - 6:10 AM UTC)

[O2-3-02]Cooling System Design Tool for Converter Thermal Analysis and Junction Temperature Estimation

*Tian Luo¹, Haiyan Ma¹, Weichi Zhang¹, Yunni Li², Wiktoria Rubak³, Pablo Arevalo-Aguilar⁴ (1. Hitachi Energy China Ltd (China), 2. Hitachi Energy Ltd. (Switzerland), 3. Hitachi Energy Poland Sp. z o.o. (Poland), 4. Hitachi Energy Spain s.a.u (Spain))

3:10 PM - 3:30 PM JST(6:10 AM - 6:30 AM UTC)

[O2-3-03]Compact Two-Phase Dielectric Fluid Cooling System for Power-Dense PCBs

*Lars van Eeuwijk¹, Jasper Kadijk¹, Remco Bonten¹, Jan Schellekens¹, Bas Vermulst¹ (1. Eindhoven University of Technology (Netherlands))

3:30 PM - 3:50 PM JST(6:30 AM - 6:50 AM UTC)

[O2-3-04]Thermal and Mechanical Characterization of One-Component, Non-Curing Gap Fillers for Top-Side Cooled MOSFETs

*Joel Schön¹, Zerdest Pervane¹, Jörg Franke¹, Patrick Bründl¹ (1. Institute for Factory Automation and Production Systems, Universität Erlangen-Nürnberg (Germany))

3:50 PM - 4:10 PM JST(6:50 AM - 7:10 AM UTC)

[O2-3-05]POD-CGaNet for Fast PCB Thermal Prediction and Heatsink Design

*Jiaze Kong¹, Bangli Du¹, Xiaobing Shen¹, Yu Zuo¹, Wilmar Martinez¹ (1. KU Leuven - Energyville (Belgium))

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