[O4-3] Thermal Management for Semiconductor Devices 2

10:45 AM - 11:05 AM JST(1:45 AM - 2:05 AM UTC)

[O4-3-01] Fabrication-Friendly 3D Structural Design of a High-Power-Density Three-Phase Inverter for Liquid Immersion Cooling

*Norihiro Izu¹, Daiki Satou¹ (1. Tokyo Denki University (Japan))

Keywords:

GaN HEMT,inverter,liquid immersion cooling,thermal analysis