[O4-3] Thermal Management for Semiconductor Devices 2 | IPEC2026

Session Details

Regular SessionSemiconductor Power Conversion : Emerging technologies in Packaging, thermal management, system integration and Reliability (Advanced fault protection systems, Diagnostics)

[O4-3]Thermal Management for Semiconductor Devices 2

Tue. Jun 2, 2026 10:45 AM - 12:05 PM JST
Tue. Jun 2, 2026 1:45 AM - 3:05 AM UTC

Room 101C(1F)

Chair:Alberto Castellazzi(Kyoto University of Advanced Science), Paul Sochor(Infineon Technologies)

10:45 AM - 11:05 AM JST(1:45 AM - 2:05 AM UTC)

[O4-3-01]Fabrication-Friendly 3D Structural Design of a High-Power-Density Three-Phase Inverter for Liquid Immersion Cooling

*Norihiro Izu¹, Daiki Satou¹ (1. Tokyo Denki University (Japan))

11:05 AM - 11:25 AM JST(2:05 AM - 2:25 AM UTC)

[O4-3-02]Shunt Resistor-Integrated Power Module with Slit Design for Reduced Temperature Coefficient of Resistance

*Sihoon Choi¹, Thiyu Sansika Warnakulasooriya¹, Jun Imaoka¹, Masayoshi Yamamoto¹, Keishi Nakamura², Koji Shigesawa² (1. Nagoya University (Japan), 2. KOA Co., Ltd. (Japan))

11:25 AM - 11:45 AM JST(2:25 AM - 2:45 AM UTC)

[O4-3-03]Design and Prototyping of A 3.3 kV Double Side Cooled SiC MOSFET Power Module with Porous Silver Interconnect and Microchannel Cooler

Li Zhang¹, Zachary Zintak¹, Peiyuan Sun¹, Joshua Gardner¹, *Guo-Quan Lu¹ (1. Virginia Tech (USA))

11:45 AM - 12:05 PM JST(2:45 AM - 3:05 AM UTC)

[O4-3-04]Effect of Temperature-Dependent Saturation Current on Voltage Balancing of Series-Connected SiC MOSFETs during Short-Circuit Events

*Enyao Xiang¹, Chengmin Li¹, Dongsheng Yang¹ (1. Eindhoven University of Technology (Netherlands))

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