[P2-2] Emerging technologies in Packaging, thermal management, system integration and reliability 1

[P2-2-06] Current Balance Improvement in a Multi-Chip Power Module Using a Slitted Conductor Structure

*Shota Tashiro¹, Yuta Ichikura¹, Kazuyasu Takimoto¹, Takahiro Ishiguro¹ (1. Toshiba Corporation (Japan))

Keywords:

conductor design,current balance,loop inductance,power modules