[P2-4] Device-related technologies, Passive components and materials 2

[P2-4-09] Flip Chip SiC Power Module for Common-Mode Noise Reduction with an Integrated Shunt Resistor

*Thiyu Sansika Warnakulasooriya¹, Sihoon Choi², Yu Yonezawa², Jun Imaoka², Masayoshi Yamamoto² (1. Department of Electrical Engineering, Nagoya University (Japan), 2. Institute of Materials and Systems for Sustainability, Nagoya University (Japan))

Keywords:

Common-mode noise,Flip-chip technology,Power module packaging,Shunt resistor integration