Session Details
[O6-10]Semiconductor Power Conversion
Tue. Jun 2, 2026 2:20 PM - 4:00 PM JST
Tue. Jun 2, 2026 5:20 AM - 7:00 AM UTC
Tue. Jun 2, 2026 5:20 AM - 7:00 AM UTC
Online Session(Online)
Chair:Tomoyuki MANNEN(Utsunomiya University), Wei Han(Hong Kong University of Science and Technology (Guangzhou))
[O6-10-01]IGBT Junction Temperature Monitoring Under Practical Operating Conditions Considering Conduction Voltage Drop Variations
*Shuangzhe Chen1, LeLe Wei1, Dangsheng Zhou2, Sufei Wang2, Tianhao Wu2, Ke Ma1 (1. School of Electrical Engineering, Shanghai Jiao Tong Univerisity (China), 2. R&D Center Shenzhen Hopewind Electric Co., Ltd., Shenzhen (China))
[O6-10-02]Hybrid Collaborative FCS-MPC Strategy for Junction Temperature Optimization of Power Switching Devices in MMC
*Chengxuan Li1, Dong Wang1, Xiaoqiong He1, Hongxin Peng1, Yuhao Hui1 (1. Southwest Jiaotong University (China))
[O6-10-03]An Optimized Update-Time Method for Mitigating Transient DC-Bias in Triple Active Bridge Converters
*Zitong Huang1, Xiaoqiong He1, Jia Tang1 (1. Southwest Jiaotong University (China))
[O6-10-04]Demostration of A 1700V Enhancement Mode pGaN Gate HEMT Power Device on Sapphire Substrate
*Ju Gao1, Ziheng Liu1, Jiayin He1, Wenbo Xia1, Chengkang Ao1, Hongjie Peng1, Lanlan Wang1, Yimeng Cai2, Yi Sun2, Zhaohui Cheng3, Yong Xie3, Jin Wei1, Jinyan Wang1 (1. Peking University (China), 2. ZhiCheng Semiconductor (Anhui) Co., Ltd (China), 3. Dongke Semiconductor (Anhui) Co., Ltd (China))
[O6-10-05]Design, Packaging and Evaluation of a Si/SiC Hybrid Five-Level ANPC Power Module
*Ziyu Gu1, Jupeng Pang1, Chao Wang1, Ruifeng Yue1, Yan Wang1, Kui Wang1, Yongdong Li1 (1. Tsinghua University (China))
