[O5] Quantification of solidification phenomena using multiple approaches V-1

10:20 AM - 10:40 AM JST(1:20 AM - 1:40 AM UTC)

[55] Simulation of microstructural evolution in senary Cu/Ag-Cu-Sn-Ti filler metal/Si₃N₄ active metal brazed joint by CALPHAD-coupled phase-field method

^○Takumi Morino¹, Shoichi Hirosawa¹, Machiko Ode², Yoichiro Mori³, Seiichi Suenaga³ (1.Yokohama National Univ., 2.NIMS, 3.Niterra Materials)