Plasma Science & Technologies 3

5:30 PM - 5:45 PM JST(8:30 AM - 8:45 AM UTC)

[04pA09O] Low Temperature of Atomic Layer Etching of Si₃N₄ with CHF₃/O₂ Plasma and Ar Ion Bombardment

*Taeseok Jung¹, Daeun Hong², Hyeongwu Lee³, Minsung Jeon¹, Heeyeop Chae^1,2,3 (1. Department of Semiconductor Convergence Engineering, Sungkyunkwan University (SKKU) (Korea), 2. School of Chemical Engineering, Sungkyunkwan University (SKKU) (Korea), 3. SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University (SKKU) (Korea))