Plasma Sceience & Technologies 10

10:45 AM - 11:00 AM JST(1:45 AM - 2:00 AM UTC)

[07aA05O] Investigation on Cu-xNi/Sn3.5Ag/Cu Full IMC Micro-joint via Thin Film Metallization for 3D-IC Applications

*Ta-Wei Lin¹, Shao-Hsuan Chin¹, Jenq-Gong Duh¹ (1. National Tsing Hua University (Taiwan))