Presentation Information
[WB8-03-INV]TDGL Analysis of Flux Pinning in Coated Conductors: Effects of Pin Density and Strain Field Distribution
*Kaname Matsumoto Matsumoto1,2, Tomoya Horide2, Yutaka Yoshida2 (1. Kyushu Inst. Tech. (Japan), 2. Nagoya Univ. (Japan))
Keywords:
REBCO,coated conductor,flux pinning,TDGL,strain
[Purpose] To evaluate the combined effects of pin density and local strain on flux pinning in REBCO films and to identify optimization guidelines.
[Method] Two-dimensional TDGL simulations with varying nanorod sizes and densities plus oxygen vacancies. An original elasticity-based strain distribution method was developed and preliminarily integrated with TDGL.
[Results] Without strain, Fp reached 3.7–3.8 TN/m³ at 6–8 vol.%, while experiments show degradation above ~4 vol.%
[Consideration] The discrepancy likely arises from strain fields, which reduce the order parameter and effective current paths, leading to Jc degradation.
[Conclusion] The trade-off between pin density and strain is key for REBCO optimization. Integrating TDGL with elasticity analysis may provide future design guidelines.
[Method] Two-dimensional TDGL simulations with varying nanorod sizes and densities plus oxygen vacancies. An original elasticity-based strain distribution method was developed and preliminarily integrated with TDGL.
[Results] Without strain, Fp reached 3.7–3.8 TN/m³ at 6–8 vol.%, while experiments show degradation above ~4 vol.%
[Consideration] The discrepancy likely arises from strain fields, which reduce the order parameter and effective current paths, leading to Jc degradation.
[Conclusion] The trade-off between pin density and strain is key for REBCO optimization. Integrating TDGL with elasticity analysis may provide future design guidelines.