Presentation Information
[WBP1-25][WBP1-25] Thermal Analysis of Solder-Free Sonic Welding Process Using Finite Element Method
*Shinya Sera1、Takanobu Kiss1,2、Zeyu Wu1、Kohei Higashikawa1,2 (1. Dept. of Electrical Engineering, Kyushu Univ. (Japan), 2. Research Institute of Superconductor Science and Systems, Kyushu Univ. (Japan))
Keywords:
REBCO CC,Sonic Welding,Solder-Free,Low resistive joint
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