[WBP1] Conductor Processing & Evaluation

[WBP1-25] [WBP1-25] Thermal Analysis of Solder-Free Sonic Welding Process Using Finite Element Method

*Shinya Sera¹、Takanobu Kiss^1,2、Zeyu Wu¹、Kohei Higashikawa^1,2  (1. Dept. of Electrical Engineering, Kyushu Univ. (Japan), 2. Research Institute of Superconductor Science and Systems, Kyushu Univ. (Japan))

Keywords:

REBCO CC,Sonic Welding,Solder-Free,Low resistive joint

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