Presentation Information

[336]Growth behavior of compounds due to reactive diffusion between solid Co and liquid Sn-Cu alloys

*O Minho1, Kajihara Masanori1 (1. Tokyo Institute of Technology, Dept. Mater. Sci. Eng.)

Keywords:

reactive diffusion,intermetallic compound,Co-Sn system

Kinetics of the reactive diffusion between solid Co and liquid Sn-Cu was experimentally observed using isothermal bonding technique.